List of Steps
This is a list of processing techniques that are employed numerous times in a modern electronic device and do not necessarily imply a specific order.
- Wafer processing
- Wet cleans
- Photolithography
- Ion implantation (in which dopants are embedded in the wafer creating regions of increased (or decreased) conductivity)
- Dry etching
- Wet etching
- Plasma ashing
- Thermal treatments
- Rapid thermal anneal
- Furnace anneals
- Thermal oxidation
- Chemical vapor deposition (CVD)
- Physical vapor deposition (PVD)
- Molecular beam epitaxy (MBE)
- Electrochemical deposition (ECD). See Electroplating
- Chemical-mechanical planarization (CMP)
- Wafer testing (where the electrical performance is verified)
- Wafer backgrinding (to reduce the thickness of the wafer so the resulting chip can be put into a thin device like a smartcard or PCMCIA card.)
- Die preparation
- Wafer mounting
- Die cutting
- IC packaging
- Die attachment
- IC bonding
- Wire bonding
- Thermosonic bonding
- Flip chip
- Wafer bonding
- Tab bonding
- IC encapsulation
- Baking
- Plating
- Lasermarking
- Trim and form
- IC testing
Read more about this topic: Semiconductor Growth
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