History
When feature widths were far greater than about 10 micrometres, purity was not the issue that it is today in device manufacturing. As devices became more integrated, cleanrooms became even cleaner. Today, the fabs are pressurized with filtered air to remove even the smallest particles, which could come to rest on the wafers and contribute to defects. The workers in a semiconductor fabrication facility are required to wear cleanroom suits to protect the devices from human contamination.
Semiconductor device manufacturing has spread from Texas and California in the 1960s to the rest of the world, such as Europe, Middle East, and Asia. It is a global business today. The leading semiconductor manufacturers typically have facilities all over the world. Intel, the world's largest manufacturer, has facilities in Europe and Asia as well as the U.S. Other top manufacturers include Taiwan Semiconductor Manufacturing Company (Taiwan), STMicroelectronics (Europe), Analog Devices (US), Integrated Device Technology (US), Atmel (US/Europe), Freescale Semiconductor (US), Samsung (Korea), Texas Instruments (US), IBM (US), GlobalFoundries (Germany, Singapore, future New York fab in construction), Toshiba (Japan), NEC Electronics (Japan), Infineon (Europe, US, Asia), Renesas (Japan), Fujitsu (Japan/US), NXP Semiconductors (Europe and US), Micron Technology (US), Hynix (Korea), and SMIC (China).
Read more about this topic: Semiconductor Device Fabrication
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