Description
The land grid array is a packaging technology with a square grid of contacts on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste.
LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit both in a socket or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls and use a flat contact which is soldered directly to the PCB and BGA packages have balls as their contacts in between the IC and the PCBs.
Read more about this topic: Land Grid Array
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