Fully Buffered DIMM - Future

Future

As of September 2006, AMD has taken FB-DIMM off their roadmap. In December 2006, AMD has revealed in one of the slides that microprocessors based on the new K10 microarchitecture has the support for FB-DIMM "when appropriate". In addition, AMD also developed Socket G3 Memory Extender (G3MX), which uses a single buffer for every 4 modules instead of one for each, to be used by Opteron-based systems in 2009.

At the 2007 Intel Developer Forum, it was revealed that major memory manufacturers have no plans to extend FB-DIMM to support DDR3 SDRAM. Instead, only registered DIMM for DDR3 SDRAM had been demonstrated.

In 2007, Intel demonstrated FB-DIMM with shorter latencies, CL5 and CL3, showing improvement in latencies.

On August 5, 2008, Elpida Memory announced that it would mass-produce the world's first FB-DIMM at 16 Gigabyte capacity, as from Q4 2008, however as of January 2011 the product has not appeared and the press release has been deleted from Elpida's site.

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