Uni Pro
UniProSM (or Unified Protocol) is a high-speed interface technology for interconnecting integrated circuits in mobile phones or comparable products. The various versions of the UniPro standard are created within the MIPI® Alliance.
The UniPro technology and associated physical layers aim to provide high-speed data communication (gigabits/second), low-power operation (low swing signaling, standby modes), low pin count (serial signaling, multiplexing), small silicon area (small packet sizes), data reliability (differential signaling, error recovery) and robustness (proven networking concepts, including congestion management).
UniPro versions 1.0, 1.1 and 1.4x concentrate on enabling high-speed point to point communication between chips in mobile phones. UniPro has provisions for supporting networks consisting of up to 128 UniPro devices (integrated circuit, modules, etc.). Network features are planned in future UniPro releases. In such a networked environment, pairs of UniPro devices are interconnected via so-called links while data packets are routed toward their destination by UniPro switches. These switches are analogous to the routers used in wired LAN based on gigabit Ethernet. But unlike a LAN, the UniPro technology was designed to connect chips within a mobile terminal, rather than to connect computers within a building.
Read more about Uni Pro: History and Aims, Main Features, Layered Architecture, Phased Roadmap, Scope and Applicability, Versions and Roadmap, Protocol Stack Architecture, See Also
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