Low Cost Development Platforms
The MSP430F2013 and its siblings are set apart by the fact that (except for the MSP430G2 Value Line) it is the only MSP430 part that is available in a dual in-line package (DIP). Other variants in this family are only available in various surface-mount packages. TI has gone to some trouble to support the eZ430 development platform by making the raw chips easy for hobbyists to use in prototypes.
Read more about this topic: TI MSP430
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