Thick Film Technology - Mounting of Capacitors Semiconductors

Mounting of Capacitors Semiconductors

The development of the SMD process actually evolves from the thick film process. Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for minituarization of the circuits as all the extra encapsulation is not necessary.

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    Grim-visaged War hath smoothed his wrinkled front;
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    William Shakespeare (1564–1616)