Mounting of Capacitors Semiconductors
The development of the SMD process actually evolves from the thick film process. Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for minituarization of the circuits as all the extra encapsulation is not necessary.
Read more about this topic: Thick Film Technology
Famous quotes containing the word mounting:
““Courage!” he said, and pointed toward the land,
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In the afternoon they came unto a land
In which it seemed always afternoon.”
—Alfred Tennyson (1809–1892)