Advantages
The main advantages of SMT over the older through-hole technique are:
- Smaller components. As of 2012 smallest was 0.2 × 0.1 mm (0.01 in × 0.005 in: 01005).
- Much higher component density (components per unit area) and many more connections per component.
- Lower initial cost and time of setting up for production.
- Fewer holes need to be drilled.
- Simpler and faster automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.
- Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads.
- Components can be placed on both sides of the circuit board.
- Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
- Better mechanical performance under shake and vibration conditions.
- Many SMT parts cost less than equivalent through-hole parts.
- Better EMC compatibility (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the smaller lead inductance.
Read more about this topic: Surface-mount Technology
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