Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Growth
Famous quotes containing the words die and/or preparation:
“I seek in books only to give myself pleasure by honest amusement; or if I study, I seek only the learning that treats of the knowledge of myself and instructs me in how to die well and live well.”
—Michel de Montaigne (1533–1592)
“With memory set smarting like a reopened wound, a man’s past is not simply a dead history, an outworn preparation of the present: it is not a repented error shaken loose from the life: it is a still quivering part of himself, bringing shudders and bitter flavours and the tinglings of a merited shame.”
—George Eliot [Mary Ann (or Marian)