Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Growth
Famous quotes containing the words die and/or preparation:
““Not to die on the straw at home,
Those hands to close these eyes,
That is all I ask, my dear,
From the old man in the skies.”
Day-break and a candle end.”
—William Butler Yeats (1865–1939)
“It’s sad but true that if you focus your attention on housework and meal preparation and diapers, raising children does start to look like drudgery pretty quickly. On the other hand, if you see yourself as nothing less than your child’s nurturer, role model, teacher, spiritual guide, and mentor, your days take on a very different cast.”
—Joyce Maynard (20th century)