Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Growth
Famous quotes containing the words die and/or preparation:
““Oh, the fighting races don’t die out,
If they seldom die in bed,
For love is first in their hearts, no doubt,””
—Joseph I. C. Clarke (1846–1925)
“With memory set smarting like a reopened wound, a man’s past is not simply a dead history, an outworn preparation of the present: it is not a repented error shaken loose from the life: it is a still quivering part of himself, bringing shudders and bitter flavours and the tinglings of a merited shame.”
—George Eliot [Mary Ann (or Marian)