Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
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Famous quotes containing the words die and/or preparation:
“Mind and spirit together make up that which separates us from the rest of the animal world, that which enables a man to know the truth and that which enables him to die for the truth.”
—Edith Hamilton (1867–1963)
“It’s sad but true that if you focus your attention on housework and meal preparation and diapers, raising children does start to look like drudgery pretty quickly. On the other hand, if you see yourself as nothing less than your child’s nurturer, role model, teacher, spiritual guide, and mentor, your days take on a very different cast.”
—Joyce Maynard (20th century)