Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Growth
Famous quotes containing the words die and/or preparation:
“The discipline of the Old Testament may be summed up as a discipline teaching us to abhor and flee from sin; the discipline of the New Testament, as a discipline teaching us to die to it.”
—Matthew Arnold (1822–1888)
“Living each day as a preparation for the next is an exciting way to live. Looking forward to something is much more fun than looking back at something—and much more constructive. If we can prepare ourselves so that we never have to think, “Oh, if I had only known, if I had only been ready,” our lives can really be the great adventure we so passionately want them to be.”
—Hortense Odlum (1892–?)