Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Growth
Famous quotes containing the words die and/or preparation:
“I didn’t think I’d come out alive; in fact, I was seeing death. But I was prepared to die as long as I died for the truth, and I knew that people would know that this was the case.”
—Connie Mofokeng (b. 1959)
“With memory set smarting like a reopened wound, a man’s past is not simply a dead history, an outworn preparation of the present: it is not a repented error shaken loose from the life: it is a still quivering part of himself, bringing shudders and bitter flavours and the tinglings of a merited shame.”
—George Eliot [Mary Ann (or Marian)