Power Electronic Substrate - Active Metal Brazed Substrate

Active Metal Brazed Substrate

Another technology to attach thick metal layers to ceramic plates is the AMB (active metal braze) technology. With this process a metal foil is soldered to the ceramic using als solder paste and high temperature (800 °C – 1000 °C). The process itself requires vacuum. Therefore, though AMB is electrically very similar to DBC, it is only suited for small production lots.

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