Later Developments
The same basic packaging technology (both device and module) was also used for the devices that replaced SLT as IBM gradually transitioned from hybrid integrated circuits to monolithic integrated circuits:
- Solid Logic Dense (SLD) increased packaging density and circuit performance by mounting the discrete transistors and diodes on top of the substrate and the resistors on the bottom.
- Advanced Solid Logic Technology (ASLT) increased packaging density and circuit performance by stacking two substrates in the same package.
- Monolithic System Technology (MST) increased packaging density and circuit performance by replacing discrete transistors and diodes with one to four monolithic integrated circuits (resistors now external from the package on the module).
Read more about this topic: IBM Solid Logic Technology
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