Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.
Read more about Die Preparation: Wafer Mounting, Semiconductor-die Cutting, Types of Blades, Further Reading
Famous quotes containing the words die and/or preparation:
“We’re born alone, we live alone, we die alone. Only through our love and friendship can we create the illusion for the moment that we’re not alone.”
—Orson Welles (1915–1984)
“Living each day as a preparation for the next is an exciting way to live. Looking forward to something is much more fun than looking back at something—and much more constructive. If we can prepare ourselves so that we never have to think, “Oh, if I had only known, if I had only been ready,” our lives can really be the great adventure we so passionately want them to be.”
—Hortense Odlum (1892–?)