Different manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead), in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), and various thickness varying between 0.9–1.0 mm for normal packages and 0.4 mm for extremely thin. Abbreviations include:
|DFN||dual flat no-lead package|
|TDFN||thin dual flat no-lead package|
|UTDFN||ultra-thin dual flat no-lead package|
|XDFN||extremely thin dual flat no-lead package|
|QFN||quad flat no-lead package|
|QFN-TEP||quad flat no-lead package with top-exposed pad|
|TQFN||thin quad flat no-lead package|
|LLP||leadless leadframe package||National Semiconductor|
|LPCC||leadless plastic chip carrier||ASAT Holdings|
|MLPD||micro-leadframe package dual|
|MLPM||micro-leadframe package micro|
|MLPQ||micro-leadframe package quad|
|DRMLF||dual-row micro-leadframe package|
|VQFN||very thin quad flat no-lead||Texas Instruments and others|
Micro leadframe package (MLP) is a family of integrated circuit QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stands for quad), MLPM (M stands for micro), and MLPD (D stands for dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to chip scale packages (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for small-outline integrated circuit (SOIC) packages.
MicroLeadFrame (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the printed circuit board. The die attach paddle is exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the circuit board. This also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.
A more recent design variation which allows for higher density connections is the Dual Row MicroLeadFrame (DRMLF) package. This is an MLF package with two rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.
Read more about this topic: Quad-flat No-leads Package
Other articles related to "variants":
... Several puzzles can be considered variants of the original Sokoban game, in the sense that they all make use of a controllable character who pushes boxes around a maze ... Several variants apply the rules of Sokoban to mazes laid out on other tilings ... Alternative pushers In the variants Multiban and Interlock the player can control multiple characters ...
... Day-fighter variants (MiG-17, MiG-17F) were armed with two 23 mm NR-23 cannons (80 rpg) and one 37 mm N-37 cannon (40 rounds), which were mounted on a ... On radar-equipped variants (MiG-17P, MiG-17PF), the 37 mm N-37 was replaced with a third 23 mm NR-23 (carrying 100 rpg) to compensate for the weight aft of ... All variants could carry 100 kg (220 lb) bombs on two underwing pylons and some could carry 250 kg (551 lb) bombs however, these pylons were usually ...
... The Gun, Machine, Vickers.5-inch, Mk ... II was used in tanks, the earlier Mark I having been the development model ...
... NATO Name Remarks An-12B-PP and An-12BK-IS/-PP/-PPS > 150 1964-date Cub-A/B/C/D Over 150 EW variants produced ... An-26M - ??-?? Curl ELINT 1398 An-26 built in all variants ... An-26RM/RTR/RR 42+ ??-date Curl-B SIGINT/COMINT variants ...
... Its G-limits were increased from +7Gs in initial variants to +8.5Gs in the latest variants ...
Famous quotes containing the word variants:
“Nationalist pride, like other variants of pride, can be a substitute for self-respect.”
—Eric Hoffer (19021983)