Quad-flat No-leads Package - Variants

Variants

Different manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead), in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), and various thickness varying between 0.9–1.0 mm for normal packages and 0.4 mm for extremely thin. Abbreviations include:

Package Manufacturer
DFN dual flat no-lead package
TDFN thin dual flat no-lead package
UTDFN ultra-thin dual flat no-lead package
XDFN extremely thin dual flat no-lead package
QFN quad flat no-lead package
QFN-TEP quad flat no-lead package with top-exposed pad
TQFN thin quad flat no-lead package
LLP leadless leadframe package National Semiconductor
LPCC leadless plastic chip carrier ASAT Holdings
MLF micro-leadframe Amkor Technology
MLPD micro-leadframe package dual
MLPM micro-leadframe package micro
MLPQ micro-leadframe package quad
DRMLF dual-row micro-leadframe package
VQFN very thin quad flat no-lead Texas Instruments and others

Micro leadframe package (MLP) is a family of integrated circuit QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stands for quad), MLPM (M stands for micro), and MLPD (D stands for dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to chip scale packages (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for small-outline integrated circuit (SOIC) packages.

MicroLeadFrame (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the printed circuit board. The die attach paddle is exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the circuit board. This also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.

A more recent design variation which allows for higher density connections is the Dual Row MicroLeadFrame (DRMLF) package. This is an MLF package with two rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.

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