Process Technologies
Early PALs were 20-pin DIP components fabricated in silicon using bipolar transistor technology with one-time programmable (OTP) titanium-tungsten programming fuses. Later devices were manufactured by Lattice Semiconductor and Advanced Micro Devices using CMOS technology.
The original 20 and 24-pin PALs were described by MMI as medium-scale integration (MSI) devices.
Read more about this topic: Programmable Array Logic
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