Electron Beam Physical Vapor Deposition - The Substrate

The Substrate

The substrate on which the film deposition takes place is ultrasonically cleaned and fastened to the substrate holder. The substrate holder is attached to the manipulator shaft. The manipulator shaft moves translationally to adjust the distance between the ingot source and the substrate. The shaft also rotates the substrate at a particular speed so that the film is uniformly deposited on the substrate. A negative bias D.C. voltage of 200 V – 400 V can be applied to the substrate. Often, focused high energy electrons from one of the electron guns or infrared light from heater lamps is used to preheat the substrate.

Read more about this topic:  Electron Beam Physical Vapor Deposition