Electron Beam Physical Vapor Deposition or EBPVD is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.
Read more about Electron Beam Physical Vapor Deposition: Introduction, Thin Film Deposition Process, Material Evaporation Methods, The Substrate, Ion Beam Assisted Deposition, Advantages of EBPVD, Disadvantages of EBPVD
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