Thin Small-outline Package
Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, Flash memory, FSRAM and E2PROM find this package symbiotic with end-use products. It answers the needs required by telecom, cellular, memory modules, PC Cards (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.
Read more about Thin Small-outline Package: Physical Properties, Similar Packages
Famous quotes containing the word thin:
“I have no time to read newspapers. If you chance to live and move and have your being in that thin stratum in which the events which make the news transpire—thinner than the paper on which it is printed—then these things will fill the world for you; but if you soar above or dive below that plane, you cannot remember nor be reminded of them.”
—Henry David Thoreau (1817–1862)