Newer Formulations
SU-8 2000 series resists use cyclopentanone for the primary solvent and can be used to create films between 0.5 and 100 microns in thickness. This formulation may offer improved adhesion on some substrates verses the original formulation.
SU-8 3000 series resists also use cyclopentanone for the primary solvent and are designed to be spun into thicker films ranging from 2 to 75 microns in a single coat.
Its polymerization process proceeds upon photoactivation of a photoacid generator (triarylsulfonium salts) and subsequent post exposure baking. The polymerization process it a cationic chain growth, which takes place by ring opening polymerization of the epoxide groups.
Read more about this topic: SU-8 Photoresist
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