Semiconductor Device Fabrication - List of Steps

List of Steps

This is a list of processing techniques that are employed numerous times in a modern electronic device and do not necessarily imply a specific order.

  • Wafer processing
    • Wet cleans
    • Photolithography
    • Ion implantation (in which dopants are embedded in the wafer creating regions of increased (or decreased) conductivity)
    • Dry etching
    • Wet etching
    • Plasma ashing
    • Thermal treatments
      • Rapid thermal anneal
      • Furnace anneals
      • Thermal oxidation
    • Chemical vapor deposition (CVD)
    • Physical vapor deposition (PVD)
    • Molecular beam epitaxy (MBE)
    • Electrochemical deposition (ECD). See Electroplating
    • Chemical-mechanical planarization (CMP)
    • Wafer testing (where the electrical performance is verified)
    • Wafer backgrinding (to reduce the thickness of the wafer so the resulting chip can be put into a thin device like a smartcard or PCMCIA card.)
  • Die preparation
    • Wafer mounting
    • Die cutting
  • IC packaging
    • Die attachment
    • IC bonding
      • Wire bonding
      • Thermosonic bonding
      • Flip chip
      • Wafer bonding
      • Tab bonding
    • IC encapsulation
      • Baking
      • Plating
      • Lasermarking
      • Trim and form
  • IC testing

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