Biography
He received his BS in mathematics (cum laude) from The Ohio State University in 1977 and his MS and PhD in chemistry from Cornell University in 1979 and 1982, respectively.
He is a Fellow of the American Physical Society (APS), American Vacuum Society (AVS), IEEE, Materials Research Society (MRS), and Hong Kong Institution of Engineers. He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences, 2008 MRS (Taiwan) JW Mayer Lectureship, and 2011 Shanghai Natural Science First Class Award.
He is chairman of the International Plasma-Based Ion Implantation Executive Committee which organizes the biennial International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D) and a member of the Ion Implantation Technology (IIT) International Committee that organizes the biennial International Conference on Ion Implantation Technology as well as the IEEE Nuclear and Plasma Science Society Fellow Evaluation Committee.
He holds or has held advisory or visiting professorship in thirteen universities and research institutes in China, including the Institute of Microelectronics in Peking University, Department of Physics in Nanjing University, and Shanghai Institute of Ceramics of the Chinese Academy of Sciences. He has established a joint PhD program with the University of Sydney in Australia.
Prof. Chu is senior editor of IEEE Transactions on Plasma Science, associate editor of Materials Science and Engineering: Reports, and a member of the editorial board of Biomaterials, Surface and Interface Analysis, Surface and Coatings Technology, Recent Patents on Materials Science, International Journal of Molecular Engineering, and Cancer Technology: Basic, Translational, and Clinical Research.
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