Operations
The following operations are performed at the stage of packaging.
Die attachment is the step during which a die is mounted and fixed to the package or support structure (header). For high-powered applications, the die is usually eutectic bonded onto the package, using e.g. gold-tin or gold-silicon solder (for good heat conduction). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy adhesive.
- IC Bonding
- Wire bonding
- Thermosonic Bonding
- Down bonding
- Tape-automated bonding
- Flip chip
- Quilt packaging
- Tab bonding
- Film attaching
- Spacer attaching
- IC encapsulation
- Baking
- Plating
- Lasermarking
- Trim and form
- Wafer bonding
Read more about this topic: Packaging (microfabrication)
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