MIL-STD-1750A - Implementations

Implementations

Because MIL-STD-1750A did not define implementation details, 1750A products are available from a wide variety of companies in the form of component, board, and system-level offerings implemented in a myriad of technologies, often the most advanced and exotic of their respective periods (e.g. GaAs, ECL, SoS).

Of particular interest is the fact that 1750A systems often offer very high levels of radiation and other hazardous environment protection, making them particularly suited for military, aviation and space applications.

Examples of MIL-STD-1750A implementations include:

• GEC-Plessey RH1750, a radiation-hardened version for aerospace and space flight applications.
• Honeywell HX1750, fabricated on Honeywell's Silicon on Insulator CMOS (SOI-IV) process giving radiation hardness. The HX1750 includes an FPU and peripherals on chip.
• CPU Technology, Inc. CPU1750A-FB, a high performance 1750A SOC designed to give existing applications a late life performance boost.
• Pyramid Semiconductor PACE P1750A. The family includes the P1750A CPU, the P1750AE Enhanced CPU, the P1753 Memory Management Unit (MMU), the P1754 Processor Interface Chip (PIC) and the P1757ME Multi-Chip Module. This line was acquired from Performance Semiconductor in 2003.
• National Semiconductor F9450 series.
• Marconi Electronic Devices MIL-STD-1750A.
• Royal Aircraft Establishment Farnborough MIL-STD-1750A implementation in AMD 2901 bit-slice technology.
• Johns Hopkins University Applied Physics Laboratory (JHU/APL) MIL-STD-1750AAV space flight qualified processor. A multi-board silicon on sapphire implementation specifically designed for space flight.
• Dynex Semiconductor MAS281. A radiation hardened SOC implementation on a 64-pin multichip module with an optional MMU.