Through-hole
- Single in-line package: SIP
- Dual in-line package (DIP) (.1" pin spacing, rows .3" or .6" apart)
- CDIP: Ceramic DIP
- CERDIP: glass sealed ceramic DIP
- QIP: Quadruple in-line package, like DIP but with staggered (zig-zag) pins.
- SDIP: Skinny DIP (standard DIP with .1" pin spacing, rows .3" apart)
- ZIP: Zig-zag in-line package
- MDIP: Molded DIP
- PDIP: Plastic DIP
Read more about this topic: List Of Integrated Circuit Packaging Types