List of Integrated Circuit Packaging Types - Surface Mount

Surface Mount

  • CCGA: ceramic column grid array (CGA)
  • CGA: column grid array
  • CERPACK: ceramic package
  • CQGP:
  • LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch)
  • LGA: Land Grid Array
  • LTCC: Low temperature co-fired ceramic
  • MCM: Multi-Chip Module
  • MICRO SMDXT: micro Surface Mount Device extended technology

Read more about this topic:  List Of Integrated Circuit Packaging Types

Famous quotes containing the words surface and/or mount:

    Here Men from The Planet Earth
    First Set Foot upon The Moon
    July, 1969 AD
    We Came in Peace for All Mankind
    —Plaque left behind on the moon’s surface by the crew of Apollo 11.

    I mount the steps and ring the bell, turning
    Wearily, as one would turn to nod good-bye to Rochefoucauld,
    If the street were time and he at the end of the street,
    And I say, “Cousin Harriet, here is the Boston Evening Transcript.”
    —T.S. (Thomas Stearns)