Small Outline Packages
- CSOP: ceramic SOP
- MSOP: Mini Small-Outline Package
- PSOP: Plastic small-outline package
- PSON: Plastic small-outline no lead package
- QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm.
- SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
- SOP: Small Outline Package
- SSOP: Shrink Small-Outline Package
- TSOP: Thin Small-outline Package
- TSSOP: Thin Shrink Small Outline Package
- TVSOP: Thin Very Small-Outline Package
- μMAX: Similar to a SOIC. (A Maxim trademark example)
- WSON: Very Very Thin Small Outline No Lead Package
Read more about this topic: List Of Integrated Circuit Packaging Types
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—Elizabeth Bishop (1911–1979)
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—Henry David Thoreau (1817–1862)