Process Steps
- Integrated circuits are created on the wafer
- Pads are metalized on the surface of the chips
- Solder dots are deposited on each of the pads
- Chips are cut
- Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry
- Solder balls are then remelted (typically using hot air reflow)
- Mounted chip is “underfilled” using an electrically-insulating adhesive
Read more about this topic: Flip Chip
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