Inspection in Surface-mount Technology
The growing demand for Surface-mount technology equipment is reducing the need for expensive rework and repair while increasing throughput. As PCB assembly manufacturers aim for a zero-tolerance regime, the demand for pre-solder paste and pre-reflow optical inspection equipment that detect faults such as poor quality solder joints, tombstoning, and other post reflow defects is expected to rise significantly. Technological improvements in AOI equipment have resulted in higher throughput, repeatability, and reliability as well as increasing quality and production yields for the PCB assembly manufacturers.
AOI's for a PCB board with components may inspect the following features:
- Area Defects
- Billboarding
- Component offset
- Component polarity
- Component presence/absence
- Component skew
- Excessive solder joints
- Flipped component
- Height Defects
- Insufficient paste around Leads
- Insufficient solder joints
- Lifted leads
- No-population tests
- Paste registration
- Severely damaged components
- Solder bridges
- Tombstoning
- Volume defects
- Wrong part
Read more about this topic: Automated Optical Inspection
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