Three-dimensional Integrated Circuit - Simulators

Simulators

IntSim is an open-source CAD tool to simulate 2D and 3D-ICs. It can be used for predicting 2D/3D chip power, die size, number of metal levels and optimal sizes of metal levels based on various technology and design parameters. Users can also study scaling trends, and use IntSim to optimize their chip designs.

HeatWave is a commercial CAD tool to simulate whole-chip temperature down to the device level. Inputs include layout data and power data]; outputs include a 3D thermal map and tabular temperature data suitable for annotating device-level temperature data into circuit simulators. HeatWave has been used by numerous 3D-IC research groups to accurately model temperature of test chips.

Read more about this topic:  Three-dimensional Integrated Circuit