Three-dimensional Integrated Circuit - 3D ICs Vs. 3D Packaging

3D ICs Vs. 3D Packaging

3D packaging saves space by stacking separate chips in a single package. This packaging, known as System in Package (SiP) or Chip Stack MCM, does not integrate the chips into a single circuit. The chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.