Thin Small-outline Package

Thin Small-outline Package

Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, Flash memory, FSRAM and E2PROM find this package symbiotic with end-use products. It answers the needs required by telecom, cellular, memory modules, PC Cards (PCMCIA cards), wireless, netbooks and countless other product applications.

TSOP is the smallest leaded form factor for flash memory.

Read more about Thin Small-outline Package:  Physical Properties, Similar Packages

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