Conclusion
The generation of heat is mainly produced by joule heating, this undesired effect has limited the performance of integrated circuits. In the preset article heat conduction was described and analytical and numerical methods to solve a heat transfer problem were presented. Using this methods, steady state temperature distribution was computed as well as the peak temperature as a function of time for a cubic die. For an input power of (or ) applied over a single surface source on the top of a cubic die a peak increment of temperature in the order of 100 K was computed. Such increase in temperature can affect the behavior of surrounding semiconductor devices. Important parameters like mobility change drastically. That is why the heat dissipation is a relevant issue and must be considered for circuit designing.
Read more about this topic: Thermal Simulations For Integrated Circuits
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