Resist - Typical Process

Typical Process

  1. Resist Deposition: The precursor solution is spin-coated on a clean (semiconductor) substrate, such as a silicon wafer, to form a very thin, uniform layer.
  2. Soft Bake: The layer is baked at a low temperature to evaporate residual solvent.
  3. Exposure: A latent image is formed in the resist e.g. (a) via exposure to ultraviolet light through a photomask with opaque and transparent regions or (b) by direct writing using a laser beam or electron beam.
  4. Development: Areas of the resist that have (or have not) been exposed are removed by rinsing with an appropriate solvent.
  5. Post-Exposure Bake
  6. Processing through the resist pattern: wet or dry etching, lift-off, doping...
  7. Resist Stripping

Read more about this topic:  Resist

Famous quotes containing the words typical and/or process:

    “Consciousness is cerebral celebrity—nothing more and nothing less. Those contents are conscious that persevere, that monopolize resources long enough to achieve certain typical and “symptomatic” effects—on memory, on the control of behavior and so forth.”
    —Daniel Clement Dennett (b. 1942)

    “Any balance we achieve between adult and parental identities, between children’s and our own needs, works only for a time—because, as one father says, “It’s a new ball game just about every week.” So we are always in the process of learning to be parents.”
    —Joan Sheingold Ditzion, Dennie, and Palmer Wolf. Ourselves and Our Children, by Boston Women’s Health Book Collective, ch. 2 (1978)