Resist - Typical Process

Typical Process

1. Resist Deposition: The precursor solution is spin-coated on a clean (semiconductor) substrate, such as a silicon wafer, to form a very thin, uniform layer.
2. Soft Bake: The layer is baked at a low temperature to evaporate residual solvent.
3. Exposure: A latent image is formed in the resist e.g. (a) via exposure to ultraviolet light through a photomask with opaque and transparent regions or (b) by direct writing using a laser beam or electron beam.
4. Development: Areas of the resist that have (or have not) been exposed are removed by rinsing with an appropriate solvent.
5. Post-Exposure Bake
6. Processing through the resist pattern: wet or dry etching, lift-off, doping...
7. Resist Stripping