Reflow Soldering - Thermal Profiling

Thermal Profiling

In the electronics manufacturing industry, a statistical measure, known as the Process Window Index (PWI) is used to quantify the robustness of a thermal process. PWI helps measure how well a process "fits" into a user-defined process limit known as the Specification Limit.

Each thermal profile is ranked on how it "fits" in a process window (the specification or tolerance limit). The center of the process window is defined as zero, and the extreme edge of the process window as 99%. A PWI greater than or equal to 100% indicates that the profile does not process the product within specification. A PWI of 99% indicates that the profile processes the product within specification, but runs at the edge of the process window. A PWI of 60% indicates a profile uses 60% of the process specification. By using PWI values, manufacturers can determine how much of the process window a particular thermal profile uses. A lower PWI value indicates a more robust profile.

For maximum efficiency, separate PWI values are computed for peak, slope, reflow, and soak processes of a thermal profile. To avoid the possibility of thermal shock affecting the output, the steepest slope in the thermal profile must be determined and leveled. Manufacturers use custom-built software to accurately determine and decrease the steepness of the slope. In addition, the software also automatically recalibrates the PWI values for the peak, slope, reflow, and soak processes. By setting PWI values, engineers can ensure that the reflow soldering work does not overheat or cool too quickly.