Package On Package - Typical Configurations

Typical Configurations

Two widely used configurations exist for PoP:

  • Pure memory stacking: two or more memory only packages are stacked on each other
  • Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be an application processor for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard.

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