JEDEC Standardization
- JEDEC JC-11 committee deals with package outline drawing standards related to the bottom PoP package. See documents MO-266A and JEDEC publication 95, Design Guide 4.22.
- JEDEC JC-63 committee deals with top (memory) PoP package pinout standardization. See JEDEC Standard No. 21-C, Page 3.12.2 – 1
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