History
The Mobile-ITX form factor was announced by VIA Technologies at Computex in June, 2007. The motherboard size of first prototypes was 75mm by 45mm. The design was intended for ultra-mobile computing such as a smartphone or UMPC.
The prototype boards shown to date include a x86-compliant 1 GHz VIA C7-M processor, 256 or 512 megabytes of RAM, a modified version of the VIA CX700 chipset (called the CX700S), an interface for a cellular radio module (demonstration boards contain a CDMA radio), a DC-DC electrical converter, and various connecting interfaces.
At the announcement, an ultra-mobile PC reference design was shown running Windows XP Embedded.
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