List of Integrated Circuit Packaging Types - Surface Mount

Surface Mount

  • CCGA: ceramic column grid array (CGA)
  • CGA: column grid array
  • CERPACK: ceramic package
  • CQGP:
  • LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch)
  • LGA: Land Grid Array
  • LTCC: Low temperature co-fired ceramic
  • MCM: Multi-Chip Module
  • MICRO SMDXT: micro Surface Mount Device extended technology

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