List of Integrated Circuit Packaging Types - Chip-scale Packages

Chip-scale Packages

• CSP: Chip Scale Package (package no more than 1.2x the size of the silicon chip)
• TCSP: True Chip Size Package (package is same size as silicon)
• TDSP: True Die Size Package (same as TCSP)
• MICRO SMD: a chip-size package (CSP) developed by National Semiconductor
• COB: chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package.
• COF: chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.
• COG: chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.