List of Integrated Circuit Packaging Types - Ball Grid Array

Ball Grid Array

Ball Grid Array (also CBGA, PBGA, FBGA, UFBGA, UBGA, MBGA)

    • FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
    • LBGA : Low Profile Ball Grid Array (see BGA) (also Laminate Ball Grid Array)
    • TEPBGA: Thermally Enhanced Plastic BGA.
    • CBGA: Ceramic Ball Grid Array
    • OBGA: Organic Ball Grid Array
    • TFBGA - thin fine pitch BGA.
    • PBGA: Plastic Ball Grid Array
    • UCSP: Similar to a BGA (A Maxim trademark example)
    • μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
    • LFBGA - low profile fine pitch ball grid array
    • TBGA: Thin Ball Grid Array
    • SBGA: Super BGA - above 500 Pin count
    • UFBGA: Ultra Fine BGA

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