Laser Cutting - Process

Process

Generation of the laser beam involves stimulating a lasing material by electrical discharges or lamps within a closed container. As the lasing material is stimulated, the beam is reflected internally by means of a partial mirror, until it achieves sufficient energy to escape as a stream of monochromatic coherent light. Mirrors or fiber optics are typically used to direct the coherent light to a lens, which focuses the light at the work zone. The narrowest part of the focused beam is generally less than 0.0125 inches (0.32 mm). in diameter. Depending upon material thickness, kerf widths as small as 0.004 inches (0.10 mm) are possible. In order to be able to start cutting from somewhere else than the edge, a pierce is done before every cut. Piercing usually involves a high-power pulsed laser beam which slowly makes a hole in the material, taking around 5–15 seconds for 1⁄₂-inch-thick (13 mm) stainless steel, for example.

The parallel rays of coherent light from the laser source often fall in the range between 1⁄₁₆–1⁄₁₂ inch (1.6–2.1 mm) in diameter. This beam is normally focused and intensified by a lens or a mirror to a very small spot of about 0.001 inches (0.025 mm) to create a very intense laser beam. In order to achieve the smoothest possible finish during contour cutting, the direction of beam polarization must be rotated as it goes around the periphery of a contoured workpiece. For sheet metal cutting, the focal length is usually 1.5–3 inches (38–76 mm).

There are many different methods in cutting using lasers, with different types used to cut different material. Some of the methods are vaporization, melt and blow, melt blow and burn, thermal stress cracking, scribing, cold cutting and burning stabilized laser cutting.

Vaporization cutting

In vaporization cutting the focused beam heats the surface of the material to boiling point and generates a keyhole. The keyhole leads to a sudden increase in absorptivity quickly deepening the hole. As the hole deepens and the material boils, vapor generated erodes the molten walls blowing ejecta out and further enlarging the hole. Non melting material such as wood, carbon and thermoset plastics are usually cut by this method.

Melt and blow

Melt and blow or fusion cutting uses high-pressure gas to blow molten material from the cutting area, greatly decreasing the power requirement. First the material is heated to melting point then a gas jet blows the molten material out of the kerf avoiding the need to raise the temperature of the material any further. Materials cut with this process are usually metals.

Thermal stress cracking

Brittle materials are particularly sensitive to thermal fracture, a feature exploited in thermal stress cracking. A beam is focused on the surface causing localized heating and thermal expansion. This results in a crack that can then be guided by moving the beam. The crack can be moved in order of m/s. It is usually used in cutting of glass.

Stealth dicing of silicon wafers

The separation of microelectronic chips as prepared in semiconductor device fabrication from silicon wafers may be performed by the so-called stealth dicing process, which operates with a pulsed Nd:YAG laser, the wavelength of which (1064 nm) is well adopted to the electronic band gap of silicon (1.11 eV or 1117 nm). Further information: Wafer dicing

Reactive cutting

Also called "burning stabilized laser gas cutting", "flame cutting". Reactive cutting is like oxygen torch cutting but with a laser beam as the ignition source. Mostly used for cutting carbon steel in thicknesses over 1 mm. This process can be used to cut very thick steel plates with relatively little laser power.