Flip Chip - Process Steps

Process Steps

  1. Integrated circuits are created on the wafer
  2. Pads are metalized on the surface of the chips
  3. Solder dots are deposited on each of the pads
  4. Chips are cut
  5. Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry
  6. Solder balls are then remelted (typically using hot air reflow)
  7. Mounted chip is “underfilled” using an electrically-insulating adhesive

Read more about this topic:  Flip Chip

Famous quotes containing the words process and/or steps:

    “come peace or war, the progress of America and Europe
    Becomes a long process of deterioration—”
    —Robinson Jeffers (1887–1962)

    “They were steps for me, and I climbed up over them—to do so I needed to go on past them. But they supposed I wanted to settle down on them.”
    —Friedrich Nietzsche (1844–1900)