Flip Chip - Process Steps

Process Steps

  1. Integrated circuits are created on the wafer
  2. Pads are metalized on the surface of the chips
  3. Solder dots are deposited on each of the pads
  4. Chips are cut
  5. Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry
  6. Solder balls are then remelted (typically using hot air reflow)
  7. Mounted chip is “underfilled” using an electrically-insulating adhesive

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