In microelectronics, a dual in-line package (DIP or DIL) is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket.
A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs.
Read more about Dual In-line Package: Construction, Orientation and Lead Numbering, Descendants
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