Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.
Read more about Die Preparation: Wafer Mounting, Semiconductor-die Cutting, Types of Blades, Further Reading
Famous quotes containing the words die and/or preparation:
“We die with the dying:
See, they depart, and we go with them.
We are born with the dead:
See, they return, and bring us with them.”
—T.S. (Thomas Stearns)
“With memory set smarting like a reopened wound, a man’s past is not simply a dead history, an outworn preparation of the present: it is not a repented error shaken loose from the life: it is a still quivering part of himself, bringing shudders and bitter flavours and the tinglings of a merited shame.”
—George Eliot [Mary Ann (or Marian)