Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.
Read more about Die Preparation: Wafer Mounting, Semiconductor-die Cutting, Types of Blades, Further Reading
Famous quotes containing the words die and/or preparation:
“The good die first
And they whose hearts are dry as summer dust
Burn to the socket.”
—William Wordsworth (1770–1850)
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—Joyce Maynard (20th century)