Die Preparation

Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer mounting and wafer dicing.

Read more about Die Preparation:  Wafer Mounting, Semiconductor-die Cutting, Types of Blades, Further Reading

Famous quotes containing the words die and/or preparation:

    We die with the dying:
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    See, they return, and bring us with them.
    —T.S. (Thomas Stearns)

    With memory set smarting like a reopened wound, a man’s past is not simply a dead history, an outworn preparation of the present: it is not a repented error shaken loose from the life: it is a still quivering part of himself, bringing shudders and bitter flavours and the tinglings of a merited shame.
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