A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies, and die.
Famous quotes containing the word die:
“Knowing what [Christ] knew , knowing all about mankind—ah! who would have thought that the crime is not so much to make others die, but to die oneself—confronted day and night with his innocent crime, it became too difficult to go on. It was better to get it over with, to not defend himself, to die, in order not to be the only one to have survived, and to go elsewhere, where, perhaps, he would be supported.”
—Albert Camus (1913–1960)