CAS Latency - RAM Operation Background

RAM Operation Background

For more details on this topic, see DRAM—Operation principle.

Dynamic RAM is arranged in a rectangular array. Each row is selected by a horizontal word line. Sending a logical high signal along a given row enables the MOSFETs present in that row, connecting each storage capacitor to its corresponding vertical bit line. Each bit line is connected to a sense amplifier which amplifies the small voltage change produced by the storage capacitor. This amplified signal is then output from the DRAM chip as well as driven back up the bit line to refresh the row.

When no word line is active, the array is idle and the bit lines are held in a precharged state, with a voltage halfway between high and low. This indeterminate signal is deflected towards high or low by the storage capacitor when a row is made active.

To access memory, a row must first be selected and loaded into the sense amplifiers. This row is then active and columns may be accessed for read or write.

The CAS latency is the delay between the time at which the column address and the column address strobe signal are presented to the memory module and the time at which the corresponding data is made available by the memory module. The desired row must already be active; if it is not, additional time is required.

As an example, a typical 1 GiB SDRAM memory module might contain eight separate one-gibibit DRAM chips, each offering 128 MiB of storage space. Each chip is divided internally into eight banks of 227=128 Mibits, each of which comprises a separate DRAM array. Each array contains 214=16384 rows of 213=8192 bits each. One byte of memory (from each chip; 64 bits total from the whole DIMM) is accessed by supplying a 3-bit bank number, a 14-bit row address, and a 10-bit column address.