Ball Grid Array - Variants

Variants

• CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached.
• CABGA: Chip Array Ball Grid Array
• CTBGA: Thin Chip Array Ball Grid Array
• CVBGA: Very Thin Chip Array Ball Grid Array
• DSBGA: Die-Size Ball Grid Array
• FBGA or Fine Ball Grid Array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs.
  • Known as FineLine BGA by Altera.
• FCmBGA: Flip Chip Molded Ball Grid Array
• LFBGA: Low-profile Fine-pitch Ball Grid Array
• UFBGA and UBGA and Ultra Fine Ball Grid Array based on pitch ball grid array.
• MBGA: Micro Ball Grid Array
• PBGA: Plastic Ball Grid Array
• MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array
• TEPBGA: Thermally Enhanced Plastic Ball Grid Array
• SuperBGA (SBGA): Super Ball Grid Array
• TABGA / TBGA: Tape Array BGA
• TFBGA or Thin and Fine Ball Grid Array

Intel used a package designated BGA1 for their Pentium II and early Celeron mobile processors. BGA2 is Intel's package for their Pentium III and some later Celeron mobile processors. BGA2 is also known as FCBGA-479. It replaced its predecessor, BGA1.

The "Micro-FCBGA" (Flip Chip Ball Grid Array) is Intel's current BGA mounting method for mobile processors that use a flip chip binding technology. It was introduced with the Coppermine Mobile Celeron. Micro-FCBGA has 479 balls that are 0.78 mm in diameter. The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable.