A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.
Read more about Ball Grid Array: Description, Variants, Procurement
Famous quotes containing the words ball and/or array:
“The ball loved Flick.
I saw him rack up thirty-eight or forty
In one home game. His hands were like wild birds.”
—John Updike (b. 1932)
“Any one who knows what the worth of family affection is among the lower classes, and who has seen the array of little portraits stuck over a labourer’s fireplace ... will perhaps feel with me that in counteracting the tendencies, social and industrial, which every day are sapping the healthier family affections, the sixpenny photograph is doing more for the poor than all the philanthropists in the world.”
—Macmillan’s Magazine (London, September 1871)