Bahgat G. Sammakia - Selected Papers

Selected Papers

  • Arunasalam P, Ackler HD, Sammakia BG; Ackler, Harold D.; Sammakia, Bahgat G. (Jul-Aug 2006). "Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks". Journal of Vacuum Science & Technology B 24 (4): 1780–1784. doi:10.1116/1.2210003.
  • Desai A, Geer J, Sammakia B; Geer, James; Sammakia, Bahgat (March 2006). "Models of steady heat conduction in multiple cylindrical domains". Journal of Electronic Packaging 128 (1): 10–17. doi:10.1115/1.2159003. http://scitation.aip.org/journals/doc/JEPAE4-ft/vol_128/iss_1/10_1.html.
  • Desai A, Mahajan S, Subbarayan G, Jones W, Geer J, Sammakia B; Mahajan, Sanket; Subbarayan, Ganesh; Jones, Wayne; Geer, James; Sammakia, Bahgat (March 2006). "A numerical study of transport in a thermal interface material enhanced with carbon nanotubes". Journal of Electronic Packaging 128 (1): 92–97. doi:10.1115/1.2161231. http://scitation.aip.org/journals/doc/JEPAE4-ft/vol_128/iss_1/92_1.html.
  • Watson SP, Murray BT, Sammakia BG; Murray, B.T.; Sammakia, B.G. (June 2001). "Computational parameter study of chip scale package array cooling". IEEE Transactions on Components and Packaging Technologies (IEEE) 24 (2): 184–190. doi:10.1109/6144.926381. http://ieeexplore.ieee.org/iel5/6144/20041/00926381.pdf?tp=&arnumber=926381&isnumber=20041.
  • Sathe SB, Sammakia BG; Sammakia, Bahgat G. (June 2000). "A numerical study of the thermal performance of a tape ball grid array (TBGA) package". Journal of Electronic Packaging (ASME) 122 (2): 107–114. doi:10.1115/1.483141. http://scitation.aip.org/journals/doc/JEPAE4-ft/vol_122/iss_2/107_1.html.
  • Niu TM, Sammakia BG, Sathe S; Sammakia, B.G.; Sathe, S. (December 1999). "Void-effect modeling of flip-chip encapsulation on ceramic substrate". IEEE Transactions on Components and Packaging Technologies (IEEE) 22 (4): 484–487. doi:10.1109/6144.814962. http://ieeexplore.ieee.org/iel5/6144/17642/00814962.pdf?tp=&arnumber=814962&isnumber=17642.
  • Tran SK, Questad DL, Sammakia BG; Questad, D.L.; Sammakia, B.G. (December 1999). "Adhesion issues in flip-chip on organic modules". IEEE Transactions on Components and Packaging Technologies (IEEE) 22 (4): 519–524. doi:10.1109/6144.814967. http://ieeexplore.ieee.org/iel5/6144/17642/00814967.pdf?tp=&arnumber=814967&isnumber=17642.
  • Sathe S, Sammakia B; Sammakia, B. (November 1998). "A review of recent developments in some practical aspects of air-cooled electronic packages". Journal of Heat Transfer-Transactions of the ASME (ASME) 120 (4): 830–839. doi:10.1115/1.2825902.

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