Products
The company previously manufactured DRIE systems with a large portfolio of processes and applications, including:
- Notching free
- Profile control
- Dry release
- Patented Sharp process: Super High Aspect Ratio
- Tapered via
- High etch rate
- V shape
- Cryo process
- Through the wafer
- High etch rate and low roughness
- High aspect ratio for 3D
- Fused Silica etching
- Low smoothness
- High aspect ratio holes
Their tools could be configured to meet the specific requirements of various manufacturing configurations, from R&D to high-volume production environments.
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